MCTX Mobile & Embedded Computers GmbH

Complete Server, Storage, and Networking Solutions Target Software-Defined Data Center, Hyper Converged Infrastructure, Big Data Analytics and HPC Workloads

    Our partner Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in compute, storage and networking technologies including green computing, announces participation in the annual CeBIT exhibition being held in Hannover, Germany from March 20 to 24. Supermicro will showcase enterprise and data center solutions in Booth B-66.

This year Supermicro’s showcased products include the new SuperBlade® and BigTwin™ high density computing solutions. The 8U SuperBlade is the newest in Supermicro’s blade systems. The new 8U SuperBlade® supports both current and next generation Intel® Xeon® processor-based blade servers with the fastest 100G EDR InfiniBand and Omni-Path switches for mission critical, enterprise and data center applications. Continue reading →

congatec further standardizes interface setup for SMARC 2.0

Our partner congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – introduces new SMARC 2.0 modules supporting powerful USB C connectivity at Embedded World (hall 1, stand 358) today. The utilization of the USB-C specification makes USB interconnects even more universally applicable, further standardizing the interface setup of SMARC 2.0 based embedded devices. System designers can use USB C for standard peripherals from USB 3.1 to USB 1.0 and – a brand new option – for connecting displays or even the power supply to the system or peripheral devices, reducing cabling efforts to a single cable. In addition, the current data throughput of up to 5 Gigabit/s in line with the USB 3.1 specification serves as a turbo charger for data intensive applications. Continue reading →

Breaking the Mold of Proprietary High Cost Blade Designs, Delivering Better Acquisition Cost and Higher Density, Performance and Power Efficiency than Rackmount and OCP Servers

    Our partner Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in compute, storage and networking technologies including green computing, has announced its new SuperBlade® that delivers a better initial acquisition cost structure than traditional blade servers, rack mount and OCP servers with the density and operational efficiency of blade servers in an open Rack Scale Design enabled architecture.

The new 8U SuperBlade® supports both current and new generation Intel® Xeon® processor-based blade servers with the fastest 100G EDR InfiniBand and Omni-Path switches for mission critical, enterprise and data center applications. Continue reading →

First and Only 2U Multi-Node Systems supporting 205 watt dual-Xeon Processors, 24 DIMMs per node, and 24 All-Flash NVMe

    Our partner Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in compute, storage and networking technologies including green computing, has announced the fifth generation of its Twin family, the new BigTwin™ server architecture.

The Supermicro® BigTwin™ is a breakthrough multi-node server system with a multitude of innovations and industry firsts. BigTwin™ supports maximum system performance and efficiency by delivering 30% better thermal capacity in a compact 2U form-factor enabling solutions with the highest performance processor, memory, storage and I/O. Continuing Supermicro’s NVMe leadership the BigTwin is the first All-Flash NVMe multi-node system. Continue reading →

congatec boosts module-based high-end embedded computing

Our partner congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel® Xeon® and Gen 7 Intel® Core™ processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads. Continue reading →

congatec’s new modules are simply better

Our partner congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – has released new COM Express Compact modules in time with the launch of the 7th generation of Intel® Core™ SoC processors (codename Kaby Lake). The new conga TC175 Computer-on-Modules (COMs) with Intel’s Skylake successor –the second variant of the current 14nm microarchitecture – are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory. Continue reading →

Offers more than any credit card sized COM Express module before

Our partner congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel® Atom™, Celeron® and Pentium® processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small COM Express Mini module. Continue reading →

30% more processing power and 45% more graphics performance in 100% industrial-grade congatec quality

Our partner congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – presents the new conga-PA5 Pico-ITX single board computer (SBC) and the conga-IA5 Thin Mini-ITX motherboard, two industrial-grade, long-term available computing platforms featuring the latest Intel® Atom™, Celeron® and Pentium® processors (Codename Apollo Lake). System engineers can immediately deploy them to upgrade existing Pico-ITX and Mini-ITX designs and benefit from approximately 30% more processing power and 45% more graphics performance compared to the previous generations . Continue reading →

Everything you need for the evaluation of SMARC 2.0 and the new Intel® Atom™ low

Our partner congatec, a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services, presents the SMARC 2.0 Quick Starter Kit for Intel® Atom™ processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel® Atom™ processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wireless interfaces with standardized antenna connectors on board. Continue reading →