MCTX Mobile & Embedded Computers GmbH

congatec’s new COM Express modules deliver server-class embedded performance

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has expanded its COM Express Basic portfolio with new server-class embedded modules. The new Server-on-Modules are equipped with 6th generation Intel® Xeon® and Intel® Core™ i3 / i5 / i7 processors (codenamed Skylake). The DDR4 memory of the conga-TS170 modules provides up to twice as much system memory performance for data-intensive applications while consuming 20 percent less energy and requiring only half the footprint of DDR3 RAM that is expected to become legacy in future applications. Continue reading →

Rich and vibrant SOC graphics, full HSA 2.0 support, and even more performance starting at 12 watts

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is introducing new COM Express basic modules parallel to AMD’s launch of its new generation of high-end embedded processors. The new conga-TR3 modules with dual- or quad-core AMD Embedded R-Series SOCs offer not only a much more broadly scalable TDP from 12 to 35 watts over earlier modules and a significantly improved performance per watt but two further prominent new features: the extremely high-performance AMD Radeon™ graphics as well as full support of the HSA specification 2.0. Continue reading →

Flat, industrial-grade and powerful graphics at just 3 watts

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is extending its industrial-grade Thin Mini-ITX motherboard portfolio to include graphics-rich conga-IA4 boards with 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) and full Windows 10 support. Compared to their predecessors, the new Thin Mini-ITX boards offer increased computing and graphics performance as well as support for up to three 4k displays. Continue reading →

Enhanced computing and graphics performance for credit card sized computer modules

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, extends its portfolio of credit card-sized computer modules by integrating the new 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) on COM Express Mini modules. The new conga-MA4 module further enhances the computing and graphics performance of their predecessors and offers a new class of performance density. Despite the increase in performance, heat dissipation has been lowered to a SDP (Scenario Design Power) of 4 Watts, enabling very compact, passively cooled system designs. Continue reading →

congatec accelerates ongoing miniaturization trend by offering µQseven modules with Freescale i.MX 6 processors

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is extending its product portfolio for the most popular Qseven standard by now offering Computer-on-Modules in the 40 mm x 70 mm sub-credit-card µQseven format. The first flagship module of this next generation mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors. It caters to applications in harsh environments, which require not only compact low-power designs, but also appealing multimedia and computing performance. Continue reading →

New performance levels for 15 watt class of fanless embedded systems achieved

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has introduced four new COM Express compact modules parallel to the launch of the new 6th generation Intel® Core™ processors (codename Skylake). The new modules are specially designed for challenging applications that demand high performance in sealed, fanless system designs. They feature a 15 watt configurable TDP and are equipped exclusively with the energy-saving ULV-SoC editions based on new 14nm microarchitecture. Continue reading →

The new premium class of low-power modules supports up to three displays and 4k

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the introduction of conga-TCA4, the company’s first COM Express compact module based on the new Intel® Pentium® and Celeron® processors (codenamed Braswell). Based on this new premium class low-power design, the robust COM Express modules consume on average just 4 watts while providing increased graphics capabilities and overall performance. Up to 16 graphics execution units can support up to three HD displays or two 4k displays and achieve a theoretical peak performance of 358.4 GFlops per second. Continue reading →

Graphics-rich low-power Mini-ITX boards with SoC integrated AMD Radeon graphics and configurable TDP for industrial-grade system designs

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announces the expansion of its industrial-grade Mini-ITX motherboard portfolio with two highly efficient low-power conga-IGX variants that are based on the Gen 2 AMD Embedded G-Series SoC processor (codenamed “Steppe Eagle”) and feature powerful SoC integrated AMD Radeon graphics. Continue reading →

First congatec COM Express module to deliver server-grade performance for demanding graphics applications

Our partner congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the latest addition to its COM Express Basic portfolio: the new conga-TS97 computer module with either Intel® Core™ or Intel® Xeon® processors (codename Broadwell) manufactured in 14nm technology. The new conga-TS97 COM Express Basic module in the Intel® Xeon® version delivers server-grade performance for the first time and, compared to its predecessors, excels not only with its overall performance but particularly in terms of graphics due to the featured Intel® Iris™ Pro technology. Continue reading →

Qseven Module with 4K graphics